PACK Scheme Design

◼ ​PCB System Design:​​ Customized circuit architecture addressing overcharge/discharge/current protection, thermal management (-40℃~85℃), communication protocols, and ultra-low standby current (<10μA), compliant with global certification standards.

◼ ​Structural Engineering:​​ Holistic assessment of environmental factors for IP-rated sealing, dust resistance, salt spray protection, and impact resilience.